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D.Ryan's Profile

Forum Membership

• AUF - General Discussion
• AUF - Parts Shortage Request Tool
• TF 1 - Audit Programmes (Convenor)
• TF 2 - Harmonisation Standards
• TF 4 - ECMP and COTS assemblies, including uprating (Convenor)
• TF 5 - Lead-free | REACH
• TF 6 - Anti-counterfeit | Obsolescence management
• TF 8 - Microcircuits, diodes, transistors, and passives
• TF 11 - Atmosphere SEE radiation
• TF 12 - Mechanical parts
• Convenor Discussion
• Topic Suggestions
• ADHP Training Workshop Materials (Convenor)

Thread Subscriptions

• Ref: 1, Q-M30-U01, IECQ CA System -An Introduction, Combined IEC M30-U1~U4
• Ref: 2, Q-M31-U01, IECQ General Rules & Procedures - What to know
• Ref: 6, Q-M30-U27, Basic Introduction to Electronic Components - COTS Components and COTS Assemblies
• Ref: 7, Q-M34-U01, IECQ ADHP Scheme - an introduction
• Ref: 8, Q-M34-U03, Why an ECMP is required
• Ref: 9, Q-M34-U02, IECQ ADHP Scheme Rules of Procedure
• Ref: 10, Q-M30-U10, Understanding Plans and Guidance for reviewing them
• Ref: 11, Q-M34-U41, IEC 62239-1:2018 Clause 4.1 General
• Ref: 12, Q-M34-U42, IEC 62239-1:2018 Clause 4.2 Component Selection
• Ref: 13, Q-M34-U431, IEC 62239-1:2018 Clause 4.3 Component Selection Sub-Clause 4.3.1 General
• Ref: 14, Q-M34-U432, IEC 62239-1:2018 Sub-Clause 4.3.2 Electromagnetic Compatibility (EMC)
• Ref: 15, Q-M34-U433, IEC 62239-1:2018 Sub-Clause 4.3.3 Derating and Stress Analysis
• Ref: 16, Q-M34-U433-3, IEC 62239-1:2018 Sub-Clause 4.3.3.3 Uprating
• Ref: 17, Q-M34-U434, IEC 62239-1:2018 Sub-Clause 4.3.4 Thermal Analysis
• Ref: 18, Q-M34-U435, IEC 62239-1:2018 Sub-Clause 4.3.5 Mechanical Analysis
• Ref: 19, Q-M34-U436, IEC 62239-1:2018 Sub-Clause 4.3.6 Testing, Testability, & Maintainability
• Ref: 20, Q-M34-U437, IEC 62239-1:2018 Sub-Clause 4.3.7 Avionics Radiation Environment
• Ref: 21, Q-M34-U438, IEC 62239-1:2018 Sub-Clause 4.3.8 Management of Lead-free Termination Finish
• Ref: 22, Q-M34-U439, IEC 62239-1:2018 Sub-Clause 4.3.9 Counterfeited, Fraudulent and Recycled Component Avoidance
• Ref: 23, Q-M34-U4310, IEC 62239-1:2018 Sub-Clause 4.3.10 Moisture and Corrosion
• Ref: 24, Q-M34-U4311, IEC 62239-1:2018 Sub-Clause 4.3.11 Additional Customer Related Application Requirements
• Ref: 25, Q-M34-U441, IEC 62239-1:2018 Clause 4.4 Component Qualification, Sub-Clause 4.4.1 General
• Ref: 26, Q-M34-U442, IEC 62239-1:2018 Clause 4.4 Component Qualification, Sub-Clauses 4.4.2 ~ 4.4.6
• Ref: 27, Q-M34-U447, IEC 62239-1:2018 Clause 4.4.7 Distributor Process Management Approval
• Ref: 28, Q-M34-U448, IEC 62239-1:2018 Clause 4.4.8 Subcontractor Assembly Facility Quality
• Ref: 29, Q-M34-U45, IEC 62239-1:2018 Clause 4.5 Continuous Component Quality Assurance
• Ref: 30, Q-M34-U454, IEC 62239-1:2018 Clause 4.5.4 Component design and manufacturing process change monitoring
• Ref: 31, Q-M34-U46, IEC 62239-1:2018 Clause 4.6 Component dependability
• Ref: 32, Q-M34-U467, IEC 62239-1:2018 Clause 4.6.7 Semiconductor reliability, wear out and lifetime
• Ref: 33, Q-M34-U468, IEC 62239-1:2018 Clause 4.6.8 Reliability assessment
• Ref: 34, Q-M34-U47, IEC 62239-1:2018 Clause 4.7 Component compatibility with the equipment manufacturing process
• Ref: 35, Q-M34-U48, IEC 62239-1:2018 Clause 4.8 Component data
• Ref: 36, Q-M34-U49, IEC 62239-1:2018 Clause 4.9 Configuration control
• Ref: 37, Q-M34-U50, IEC 62239-1:2018 Clause 5.0 Plan administration requirements
• Ref: 38, Q-M34-U--, IECQ ADHP (ECMP) Exam - Finalised Draft for review.
• Ref: 39, Q-M34-U--, Reserved for any additional Hand out Materials
• Ref: 40, Q-M37-U01, IECQ CAP Scheme an introduction
• Ref: 41, Q-M37-U02, IECQ 03-7 Rules of Proceudre for the IECQ CAP Scheme
• Ref: 42, Q-M37-U03, Anti-counterfeit overview and external standards
• Ref: 43, Q-M37-U04, Anti-Counterfeit Traceability Overview
• Ref: 44, Q-M37-U06, IECQ OD 3701, Conformity Audit - Traceability Audit
• Ref: 45, Q-M37-U04, IECQ 03-7, Conformity Audit - IEC 62668-1 and IEC 62668-2
• Ref: 46, Q-M37-U05, IECQ 03-7, Conformity Audit - AS5553 Rev C
• Ref: 47, Q-M37-U08, IECQ 03-7 CoC AS6496 Franchised Distributor
• Ref: 48, Q-M37-U09, IECQ 03-7 CoC AS6081 Non-franchised Distributor
• Ref: 49, Reserved for any additional review or handouts
• Ref: 50, ECMP TMR_001, IEC 62239-1 Ed 1 auditor training handbook Rev.20210223
• Ref: 51, ECMP TMR_002, IECQ OD 3010 - Understanding Plans
• Ref: 52, ECMP TMR_003, ECMP Plan Template to IECQ IEC 62239-1
• Ref: 53, ECMP TMR_004, BAD Plan - Aerospace Company ECMP
• Ref: 54, ECMP TMR_005, BAD Plan - Semiconductor Test House CAP
• IECQ WG4 & WG6 external standards update April 2021
• Ref: 54, ECMP TMR_005, DEFICIENT Plan - Semiconductor Test House CAP
• Ref: 63, ADHP (ECMP) Day 3, Quiz Questions - Finalised Master with Key. Plus Finalised Day 3 Session Pack for TWSAR5
• Ref: 64, ADHP (ECMP) Day 4, Quiz Questions - Finalised Master with Key
• Ref: 65, ADHP (ECMP) Day 5, Quiz Questions - Finalised Master with Key
• Ref: 66, ADHP (ECMP) Day 6, Quiz Questions - Finalised Master with Key
• Ref: 67, ADHP (CAP) Day 7, Quiz Questions - Finalised Master with Key
• Ref: 68, ADHP (CAP) Day 8, Quiz Questions - Finalised Master with Key